Dr. Moein Ghadrdan
- Postdoc
- Room: 122
CN 418 - Phone: +49 721 608-23593
- moein ghadrdan ∂does-not-exist.kit edu
- ORCID
- @op0491:kit.edu
- Hermann-von-Helmholtz-Platz 1
76344 Eggenstein-Leopoldshafen
Biography
Moein Ghadrdan received the B.Sc. degree in electrical engineering from Iran University of Science and Technology, Tehran, Iran, in 2015, where he graduated as a top-ranked student. He received the M.Sc. degree in electrical engineering from Sharif University of Technology, Tehran, Iran, in 2017, also graduating with the highest rank among his peers. His M.Sc. thesis focused on the reliability-oriented design of modular multilevel converters. He received the Ph.D. degree in electrical engineering from Sharif University of Technology in 2022, completing his doctoral dissertation with an excellent evaluation. His Ph.D. research was centered on converter-level health monitoring of power electronic converters.
From 2021 to 2022, he was a Visiting Ph.D. Scholar with the AAU Energy Department, Aalborg University, Aalborg, Denmark. Since 2024, he has been a Post-Doctoral Researcher with the Institute for Technical Physics (ITEP), Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany. His research interests include converter-level health monitoring, reliability-oriented and fault-tolerant design of power electronic converters, DC grid protection, and reliability assessment of power systems.
Publication list
Ekin, Ö.; Ghadrdan, M.; Carne, G. D.; Hagenmeyer, V.
2026. IEEE Journal of Emerging and Selected Topics in Power Electronics, 14 (2), 1779–1789. doi:10.1109/JESTPE.2026.3651885
Ghadrdan, M.; Mathew, H.; Ekin, Ö.; Carne, G. De
2025. 2025 IEEE Seventh International Conference on DC Microgrids (ICDCM), Tallinn, Estonia, 04-06 June 2025, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICDCM63994.2025.11144717
Ekin, Ö.; Wiegel, F.; Spatafora, L.; Jumar, R.; Ghadrdan, M.; Waczowicz, S.; Carne, G. De; Hagenmeyer, V.
2025. 2025 IEEE 7thInternational Conference on DC Microgrids (ICDCM), 6 S., Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICDCM63994.2025.11144732
